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Old 05-22-2008, 09:00 PM   #1 (permalink)
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lifting a solder pad

please just answer in the simplest way "How to lift a solder pad", I kind of dont understand how it happens.
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Old 05-22-2008, 10:21 PM   #2 (permalink)
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Assuming by pad you mean a drop of solder has fallen onto the boardand shorted some points together? if so use a solder vacuum bulb/sucker by first heating the blob then sucking it up.

Hope this helps
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Old 05-26-2008, 10:47 PM   #3 (permalink)
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your question is confusing.... because no one wants to intentionally lift a solder pad.

so lets just go with that presumption...

a solder pad get lifted from several different ways... too much heat,
too much pressure applied to the pad when soldering
lifted off when (lol) doing tug test..means checking the solder connection bu tugging on the wire that's soldered to the pad
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Old 05-26-2008, 11:17 PM   #4 (permalink)
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thanks modderman, always answering peoples questions, and yes I just wanted to know how people did it by accident so I wouldn't do it myself.
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Old 05-27-2008, 01:15 PM   #5 (permalink)
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Quote:
Originally Posted by coolboy20062 View Post
thanks modderman, always answering peoples questions, and yes I just wanted to know how people did it by accident so I wouldn't do it myself.
the iron should be on the pretinned wire not the pad when attaching...

contact less 1/4 to 1/2 second
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Old 06-05-2008, 10:41 AM   #6 (permalink)
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Lifting a pad is definetly not something you want to do, and it won't happen as long as you're careful. Don't use a hot iron, and don't pull on wires you've already soldered down. If you do pull a pad up, you can't put it back, but it's not the end of the world. You can still place the modchip into the wii, but it's a little more difficult. (you'd have to follow the trace from the solder pad back to the leg on the drive chip, then solder it there. It's very small compared to the solder pad and should be done professionally.)
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